Method for assembling a camera module, and camera module
AssigneeRobert Bosch GmbH
InventorUwe Apel
Life of this patent
Estimating the term…
Abstract
A method for manufacturing a camera module is provided, the camera module including a lens and an image sensor chip, the image sensor chip being electrically contacted to a circuit board. After a first fitting part that surrounds the image sensor chip is positioned and secured on the circuit board, the first fitting part is joined to a second fitting part disposed on the housing of the camera module, forming an overlap region. A focus position between the housing-side lens and the image sensor chip is produced, and a materially attached connection is then generated between the fitting parts within the overlap region, in the focus position.
Claims12
A method for manufacturing a camera module including a housing, a lens and an image sensor chip, the image sensor chip being connected to a circuit board, the method comprising:
- a) positioning and securing on the circuit board a first fitting part that surrounds the image sensor chip;
- b) positioning the first fitting part to abut a second fitting part disposed on the housing of the camera module, wherein an overlap region is formed between the first and second fitting parts;
- c) establishing a focus position between the lens and the image sensor chip;
- and
- d) forming a fixed connection between the first and second fitting parts at the overlap region, in the focus position established according to c);
- wherein after a) is carried out, a cover is applied onto the first fitting part surrounding the image sensor chip, and wherein the cover is removed before b) is carried out.
Dependencies are inferred from the claim text.