Circuit board and display panel assembly having the same
AssigneeSamsung Display Co., Ltd.
InventorsKi-Yong Park, Young-Soo Choi, Hyeok-Tae Kwon
Life of this patent
Estimating the term…
Loading patent…
AssigneeSamsung Display Co., Ltd.
InventorsKi-Yong Park, Young-Soo Choi, Hyeok-Tae Kwon
Estimating the term…
A circuit board includes a capacitor and a circuit substrate. The capacitor is mounted on the first insulation layer, and a first conductive layer is disposed between the first and second insulation layers. A plurality of first holes is disposed extended through the first conductive layer, and has a mesh pattern to decrease the spread of vibration generated by the capacitor. A third insulation layer is disposed in the first holes, and the third and first insulation layers may include the same material.
A circuit board comprising:
A display panel assembly comprising:
Dependencies are inferred from the claim text.
Drawings are temporarily unavailable. Open the PDF at USPTO
From the US filing history. Foreign family members aren’t listed.
This application claims priority to Korean Patent Application No. 2009-12222, filed on Feb. 16, 2009 and all the benefits accruing therefrom under 35 U.S.C. §119, the contents of which are herein incorporated by reference in their entirety.
1. Field of the Invention
The present invention relates to a circuit board and a display panel assembly including the circuit board. More particularly, the present invention relates to a circuit board for improving the display quality of a display apparatus and a display panel assembly including the circuit board.
The above and other features and advantages of the present disclosure of invention will become more apparent by describing in detailed exemplary embodiments thereof with reference to the accompanying drawings, in which:
FIG. 1 is an exploded perspective view illustrating a display apparatus including a display panel assembly according to an exemplary embodiment of the present invention;
FIG. 2 is a schematically cross-sectional view taken along line I-I′ in FIG. 1;
Although the present disclosure is described more fully hereinafter with reference to the accompanying drawings, the underlying concepts may, however, be embodied in many different forms and should not be construed as limited to the exemplary embodiments set forth herein. Rather, these exemplary embodiments are provided so that this disclosure will be thorough and complete, and will fully convey its teachings to those skilled in the pertinent art. In the drawings, the sizes and relative sizes of layers and regions may be exaggerated for sake of clarity.
It will be understood that when an element or layer is referred to as being “on” or “connected to” another element or layer, it can be directly on or connected to the other element or layer or intervening elements or layers may be present. In contrast, when an element is referred to as being “directly on” or “directly connected to” another element or layer, there are no intervening elements or layers present. Like numerals refer to like elements throughout. As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items.
It will be understood that, although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the present invention.
Details: arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal…
By printed shielding conductors, ground planes or power plane: patterned shielding planes, ground planes or power planes
Using auxiliary mounted passive components or auxiliary substances: capacitors or dielectric substances
Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance: impedance adaptations of transmission lines by special lay-out…
About 4 years 8 months of term left · ends 20 Jun 2031 (estimated)