Case of electronic device having antenna pattern embedded therein and mold and method for manufacturing the same

A mold for manufacturing a case of an electronic device, the mold comprising:

• upper and lower molds contacted with and supported by an radiator frame, the radiator frame injection molded so that a radiator including an antenna pattern part formed of a metal sheet is exposed on one surface of the radiator frame;
• a resin material inlet formed on at least one of the upper mold or the lower mold and having a resin material introduced thereinto so that a case frame shaped inner space formed by combining the upper and lower molds becomes a case frame;
• and
• a boundary part forming part provided to at least one of the upper mold or the lower mold and having the radiator frame inserted thereinto, wherein
• the boundary part forming part has an increasing inclination in a direction in which the resin material moves in the inner space.

A method of manufacturing a case of an electronic device, the method comprising:

• forming a radiator including an antenna pattern part by pressing a metal sheet;
• injection molding a radiator frame to embed and expose the antenna pattern part in and on one surface of the radiator frame;
• allowing an outer circumferential surface of the radiator frame to be inserted into and seated in an inner side of a boundary part forming part formed in a mold of the case of the electronic device;
• and
• allowing a resin material to be introduced from an outer side of the boundary part forming part, pass through the boundary part forming part having an increasing inclination in a direction in which the resin material moves in the inner space, be introduced from an upper surface of the radiator frame and be then filled in a case frame shaped inner space formed in the mold of the case of the electronic device.