Electromagnetic bandgap structure and printed circuit board
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsHan Kim, Hyung-Sik Choi, Sang-Hoon Kim, Joon-Sung Kim
Life of this patent
Estimating the term…
Abstract
An electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit are disclosed. In accordance with an embodiment, an electromagnetic bandgap structure is stacked with a first metal layer, a first dielectric layer, a metal plate, a second dielectric layer and a second metal layer, and an odd number of vias can be serially connected through a metal line between the first metal layer and the metal plate. This electromagnetic bandgap structure can have a small size and a low bandgap frequency.
Claims20
An electromagnetic bandgap structure comprising:
- a first metal layer;
- a first dielectric layer;
- a metal plate;
- a second dielectric layer;
- a second metal layer;
- and
- an odd number of vias serially connected through a metal line between the first metal layer and the metal plate, the metal line being housed in a hole formed on at least one of the metal plate and the first metal layer.
A printed circuit board comprising:
- an analog circuit;
- a digital circuit;
- an electromagnetic bandgap structure disposed between the analog circuit and the digital circuit, the electromagnetic bandgap structure being stacked with a first metal layer, a first dielectric layer, a metal plate, a second dielectric layer and a second metal layer;
- and
- an odd number of vias serially connected through a metal line between the first metal layer and the metal plate, the metal line being housed in a hole formed on at least one of the metal plate and the first metal layer.
Dependencies are inferred from the claim text.