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US 8,710,857 B2Granted
High frequency vertical spring probe
AssigneeProbeleader Co., Ltd.
InventorsCheng-Lung Huang, Pou-Huang Chen, Hsing-Lung Chen
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AssigneeProbeleader Co., Ltd.
InventorsCheng-Lung Huang, Pou-Huang Chen, Hsing-Lung Chen
Estimating the term…
A high frequency vertical spring probe is provided in the present invention. The probe includes an unclosed ring structure having a gap disposed therein to provide an elastic property for vertical deformation. At least a first contacting component and a second contacting component are disposed on the ring structure of the probe to provide electrical connection of an external component when the probe is compressed. The first contacting component is located near two terminals of the ring structure adjacent to the gap and the second contacting component is disposed vertically corresponding to the first contacting component. The probe can serve as the electrical connection between two components or can be installed in the probe card to provide chip testing with high-frequency, high-speed and good-contacting environment.
A high frequency vertical spring probe, wherein the probe comprises an unclosed ring structure having a gap disposed therein to provide an elastic property for vertical deformation, and at least a first contacting component and a second contacting component are disposed on the ring structure of the probe to provide electrical connection of an external component when the probe is compressed, wherein the first contacting component is located near two terminals of the ring structure adjacent to the gap and the second contacting component is disposed vertically corresponding to the first contacting component, wherein at least two probes are assembled in an interlocked manner, and wherein one probe comprises a binding groove disposed on an inner surface of the ring structure, another probe comprises a holding groove disposed on an outer surface of the ring structure, wherein the binding groove of one probe is engaged with the holding groove of another probe when the probes are assembled in the interlocked manner.
A high frequency vertical spring probe, wherein the probe comprises an unclosed ring structure having a gap disposed therein to provide an elastic property for vertical deformation, and at least a first contacting component and a second contacting component are disposed on the ring structure of the probe to provide electrical connection of an external component when the probe is compressed, wherein the first contacting component is located near two terminals of the ring structure adjacent to the gap and the second contacting component is disposed vertically corresponding to the first contacting component, wherein at least two probes are vertically stacked and interlocked with each other to form a first set of probes and at least two probes are vertically stacked and interlocked with each other to form a second set of probes, wherein a binding groove is disposed on the ring structure of the first set of probes and a holding groove is disposed on the ring structure of the second set of probes, and the binding groove of the first set of probes is engaged with the holding groove of the second set of probes when the probes are assembled in an interlocked manner.
Dependencies are inferred from the claim text.