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US 8,710,683 B2Granted
Method of forming wafer level mold using glass fiber and wafer structure formed by the same
AssigneeSamsung Electronics Co., Ltd.
InventorTae Hwan Kim
Life of this patent
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Abstract
According to example embodiments, a wafer level mold may be formed by a method including attaching a substrate to a lower side of a wafer on which a semiconductor chip is arranged, applying molding liquid to an upper and at least one lateral side of the semiconductor chip and an upper side of the wafer where the semiconductor chip is not arranged, loading a fiber onto the applied liquid, forming a mold layer by compression-molding and curing the liquid loaded with the fiber, and separating the substrate from the wafer.
Claims17
A method of forming a wafer level mold comprising:
- attaching a substrate to a lower side of a wafer on which a semiconductor chip is arranged;
- loading a prepreg impregnated with a molding liquid onto an upper side of the semiconductor chip and on an upper side of the wafer where the semiconductor chip is not arranged;
- forming a mold layer by compression-molding and curing the loaded prepreg;
- and
- separating the substrate from the wafer.
2 more elements
A method of making a wafer level mold comprising:
- attaching a semiconductor chip on a wafer;
- attaching the wafer on a temporary substrate;
- forming a molding layer on the semiconductor chip and the wafer,
- the molding layer including a fiber;
- and
- separating the temporary substrate from the wafer.
3 more elements
Dependencies are inferred from the claim text.