Isolation rings for blocking the interface between package components and the respective molding compound
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChih-Horng Chang, Tin-Hao Kuo, Tsung-Fu Tsai, Min-Feng Ku
Life of this patent
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Abstract
A device includes a first package component, and a second package component underlying, and bonded to, the first package component. A molding material is disposed under the first package component and molded to the first and the second package components, wherein the molding material and the first package component form an interface. An isolation region includes a first edge, wherein the first edge of the isolation region contacts a first edge of the first package component and a first edge of the molding material. The isolation has a bottom lower than the interface.
Claims20
A device comprising:
- a first package component:
- a second package component underlying, and bonded to, the first package component;
- a molding material under the first package component and molded to the first and the second package components, wherein the molding material and the first package component form an interface;
- and
- an isolation region comprising a first edge, wherein the first edge of the isolation region contacts a first edge of the first package component and a first edge of the molding material, and wherein the isolation region has a bottom lower than the interface.
A device comprising:
- a package substrate;
- a device die underlying, and bonded to, the package substrate;
- a molding compound under the package substrate and molded to the package substrate and the device die;
- and
- a polymer encircling, and contacting edges of, the package substrate, wherein the polymer extends from a top surface of the package substrate to a level lower than a top surface of the molding compound.
A device comprising:
- a package substrate;
- a device die underlying and bonded to the package substrate;
- a molding compound under the package substrate, wherein the molding compound is in contact with a bottom surface of the package substrate, and wherein the device die is molded in the molding compound;
- and
- a polymer ring encircling the package substrate and a top portion of the molding compound, wherein the polymer ring comprises a bottom surface contacting a first top surface of the molding compound.
Dependencies are inferred from the claim text.