Back to results
US 8,710,676 B2Granted
Stacked structure and stacked method for three-dimensional chip
AssigneeIndustrial Technology Research Institute
InventorsYung-Fa Chou, Ding-Ming Kwai
Life of this patent
Estimating the term…
Abstract
A stacked structure and a stacked method for a three-dimensional integrated circuit are provided. The provided stacked method includes separating a logic chip into a function chip and an I/O chip; stacking the function chip above the I/O chip; and stacking at least one memory chip between the function chip and the I/O chip.
Claims14
A stacked structure of a three-dimensional (3D) chip, comprising:
- a function chip which is at least capable of performing arithmetic computation;
- an input/output (I/O) chip which is stacked below the function chip and performs input/output operations of the 3D chip to an external world;
- and
- a first memory chip, stacked between the function chip and the I/O chip,
- wherein the function chip and the I/O chip communicate by a serial transmission mode, the function chip and the I/O chip respectively convert data into a serial signal format by serial interfaces, and vertically transmit the data to each other through a signal line.
2 more elements
A stacked method for a three-dimensional chip, comprising:
- functionally dividing a logic chip into a function chip and an I/O chip and providing the function chip and the I/O chip, wherein the logic chip is at least capable of performing arithmetic computation and logic operations through the function chip;
- stacking the function chip above the I/O chip, wherein the I/O chip performs input/output operations to an external world;
- and
- stacking at least one memory chip between the function chip and the I/O chip, wherein the memory chip communicate to the function chip and the I/O chip,
- wherein the function chip and the I/O chip communicate by a serial transmission mode, the function chip and the I/O chip respectively convert data into a serial signal fonnat by serial interfaces, and vertically transmit the data to each other through a signal line.
2 more elements
Dependencies are inferred from the claim text.