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US 8,710,675 B2Granted
Integrated circuit package system with bonding lands
AssigneeSTATS ChipPAC, Ltd.
InventorsYoung Cheol Kim, Koo Hong Lee
Life of this patent
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Abstract
An integrated circuit package system includes a first integrated circuit die having die pads only adjacent a single edge of the first integrated circuit die, forming first bonding lands adjacent the single edge, connecting the die pads and the first bonding lands, and encapsulating the die pads and a portion of the first bonding lands to form a first package.
Claims12
A method for manufacturing an integrated circuit package system comprising:
- providing a first integrated circuit die having first die pads adjacent a first edge of the first integrated circuit die, the first integrated circuit die having a second edge opposite the first edge;
- forming first bonding lands adjacent the first edge;
- connecting the first die pads and the first bonding lands;
- forming an encapsulant over the first die pads and the first bonding lands to form a first package, the first bonding lands within and partially exposed from the encapsulant;
- providing a leadframe;
- providing a second integrated circuit die having second die pads adjacent a third edge of the second integrated circuit die, the second integrated circuit die having a fourth edge opposite the third edge;
- forming second bonding lands adjacent the third edge of the second integrated circuit die;
- connecting the second die pads and the second bonding lands;
- encapsulating the second die pads and portions of the second bonding lands to form a second package;
- stacking the second package over the first package in an offset configuration such that the fourth edge covers and overhangs the second edge and the third edge is recessed from the first edge exposing the first die pads, wherein the first bonding lands and the second bonding lands are electrically connected to the leadframe;
- and
- encapsulating the first package and the second package.
9 more elements
An integrated circuit package system comprising:
- a first integrated circuit die having first die pads adjacent a first edge of the first integrated circuit die, the first integrated circuit die having a second edge opposite the first edge;
- first bonding lands adjacent the first edge, the first bonding lands connected to the first die pads;
- a first package having an encapsulant over the first die pads and the first bonding lands, the first bonding lands within and partially exposed from the encapsulant;
- package leads;
- a second integrated circuit die having second die pads adjacent a third edge of the second integrated circuit die, the second integrated circuit die having a fourth edge opposite the third edge;
- second bonding lands adjacent the third edge of the second integrated circuit die having the second die pads and the second bonding lands connected;
- a second package having the second die pads and portions of the second bonding lands encapsulated, the second package stacked over the first package in an offset configuration such that the fourth edge covers and overhangs the second edge and the third edge is recessed from the first edge exposing the first die pads, wherein the first bonding lands and the second bonding lands are electrically connected to the package leads;
- and
- an additional encapsulant over the first package and the second package.
6 more elements
Dependencies are inferred from the claim text.