Integrated circuit packaging system with coupling features and method of manufacture thereof
AssigneeSTATS ChipPAC, Ltd.
InventorsMinJung Kim, DaeSik Choi, Wonll Kwon
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Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a wafer substrate having an active side containing a contact; forming a through silicon via extending through the wafer substrate electrically connected to the contact having a via width; forming a first coupling feature extending from a top side of the through silicon via; and forming a second coupling feature on the side of the through silicon via opposite the first coupling feature.
Claims20
A method of manufacture of an integrated circuit packaging system comprising:
- providing a wafer substrate having an active side containing a contact;
- forming a through silicon via extending through the wafer substrate electrically coupled to the contact having a via width;
- forming a first coupling feature, on the through silicon via, extending from the active side;
- forming a second coupling feature on the side of the through silicon via opposite the first coupling feature;
- and
- forming a conductive adhesive cap directly on the second coupling feature, wherein forming the first coupling feature includes the first coupling feature having a first coupling feature diameter smaller than a second coupling feature diameter.
An integrated circuit packaging system comprising:
- a wafer substrate having an active side;
- a contact formed directly on the wafer substrate;
- a through silicon via extending through the wafer substrate electrically connected to the contact and having a via width;
- a first coupling feature extending from a top side of the through silicon via;
- and
- a second coupling feature on the side of the through silicon via opposite the first coupling feature;
- a conductive adhesive cap directly on the second coupling feature;
- the first coupling feature includes a first coupling feature diameter;
- and
- the second coupling feature includes a second coupling feature diameter larger than the first coupling feature diameter.
An integrated circuit packaging system comprising:
- a wafer substrate having an active side;
- a contact formed directly on the wafer substrate;
- a through silicon via extending through the wafer substrate electrically connected to the contact and having a via width;
- a first coupling feature extending from a top side of the through silicon via;
- and
- a second coupling feature on the side of the through silicon via opposite the first coupling feature;
- and
- a conductive adhesive cap directly on the second coupling feature, wherein the second coupling feature includes a barrier layer directly on the second coupling feature for preventing diffusion between the through silicon via and the conductive adhesive cap.
Dependencies are inferred from the claim text.