Semiconductor device
AssigneePanasonic Corporation
InventorsHiroshige Hirano, Yukitoshi Ota
Life of this patent
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AssigneePanasonic Corporation
InventorsHiroshige Hirano, Yukitoshi Ota
Estimating the term…
A semiconductor device includes a first interconnect layer and a second interconnect layer provided above or under the first interconnect layer. The first interconnect layer includes a plurality of first interconnect blocks, and in each of the first interconnect blocks, a first interconnect has a first potential, and extends in at least two or more directions, and a second interconnect has a second potential, and extends in at least two or more directions. The second interconnect layer includes a third interconnect which electrically connects the first interconnect of one of a pair of adjacent first interconnect blocks and the first interconnect of the other of the pair of adjacent first interconnect blocks, and a fourth interconnect which electrically connects the second interconnect of one of the pair of adjacent first interconnect blocks and the second interconnect of the other of the pair of adjacent first interconnect blocks.
A semiconductor device, comprising:
Dependencies are inferred from the claim text.