Semiconductor device and method for fabricating the same
AssigneesAisin Aw Co., Ltd., Fuji Electric Co., Ltd.
InventorsJunji Tsuruoka, Kazuo Aoki, Masaki Ono, Katsuhiko Yoshihara
Life of this patent
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Abstract
A semiconductor device which can prevent a deterioration in the electrical properties by preventing sputters generated by laser welding from adhering to a circuit pattern or a semiconductor chip and a method for fabricating such a semiconductor device are provided. A connection conductor is bonded to a copper foil formed over a ceramic by a solder and resin is injected to a level lower than a top of the connection conductor. Laser welding is then performed. After that, resin is injected. This prevents sputters generated by the laser welding from adhering to a circuit pattern or a semiconductor chip. As a result, a deterioration in the electrical properties can be prevented.
Claims6
A semiconductor device comprising:
- a circuit pattern formed over an insulating board;
- a semiconductor chip bonded to a main surface of the circuit pattern;
- a connection conductor which has an Ω-type shape whose two lower ends are bonded to the main surface of the circuit pattern;
- a first insulating resin which exposes an upper-end welding portion of the connection conductor through a top of the first insulating resin and which covers the circuit pattern and the semiconductor chip,
- wherein the upper-end welding portion and the top of the first insulating resin are parallel to the main surface of the circuit pattern;
- and
- an external terminal which passes a main electric current through a main electrode of the semiconductor chip and which is bonded to the upper-end welding portion of the connection conductor.
A semiconductor device comprising:
- a circuit pattern formed over an insulating board;
- a semiconductor chip bonded to a main surface of the circuit pattern;
- a first connection conductor which has an Ω-type shape whose two lower ends are bonded to the main surface of the circuit pattern;
- a first insulating resin which exposes an upper-end welding portion of the first connection conductor through a top surface of the first insulating resin and which covers the circuit pattern and the semiconductor chip,
- wherein the upper-end welding portion and the top of the first insulating resin are parallel to the main surface of the circuit pattern;
- an external terminal which passes a main electric current through a main electrode of the semiconductor chip;
- and
- a second external connection conductor bonded to the external terminal and the upper-end welding portion of the first connection conductor.
Dependencies are inferred from the claim text.