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AssigneeSony Corporation & Information Device Corporation
InventorsHideaki Umakoshi, Hidetsugu Namiki, Akira Ishigami, Masaharu Aoki, Shiyuki Kanisawa, Yoshihisa Shinya
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A light-reflective anisotropic conductive paste is used as an anisotropic conductive paste when a light-emitting device is produced by flip-chip mounting a light-emitting element such as a light-emitting diode element (LED) on a wiring board. The light-reflective anisotropic conductive paste includes light-reflective insulating particles, in order to improve light emission efficiency without providing, in the LED, a light-reflecting layer that causes an increase in manufacturing cost. With the light-reflective anisotropic conductive paste, a reduction in bonding strength of the light-emitting element to the wiring board in a high-temperature environment can be suppressed, and a reduction in conduction reliability after a TCT can also be suppressed. In the light-reflective anisotropic conductive paste, conductive particles and the light-reflective insulating particles are dispersed in a thermosetting resin composition. The thermosetting resin composition contains an epoxy compound and a thermal catalyst-type curing agent.
A light-reflective anisotropic conductive paste used to connect a light-emitting element to a wiring board by anisotropic conductive connection, the light-reflective anisotropic conductive paste comprising a thermosetting resin composition, conductive particles, and light-reflective insulating particles, the conductive particles and the light-reflective insulating particles being dispersed in the thermosetting resin composition, wherein the thermosetting resin composition contains an epoxy compound and a thermal cationic polymerization catalyst-type curing agent in the form of an aromatic sulfonium compound represented by the formula (1):
A light-reflective anisotropic conductive paste used to connect a light-emitting element to a wiring board by anisotropic conductive connection, the light-reflective anisotropic conductive paste comprising a thermosetting resin composition, conductive particles, and light-reflective insulating particles, the conductive particles and the light-reflective insulating particles being dispersed in the thermosetting resin composition, wherein the thermosetting resin composition contains an epoxy compound and a thermal catalyst-type curing agent, wherein the light-reflective insulating particles are resin-coated metal particles obtained by coating surfaces of scale-like or spherical silver particles with an insulating resin.
A light-reflective anisotropic conductive paste used to connect a light-emitting element to a wiring board by anisotropic conductive connection, the light-reflective anisotropic conductive paste comprising a thermosetting resin composition, conductive particles, and light-reflective insulating particles, the conductive particles and the light-reflective insulating particles being dispersed in the thermosetting resin composition, wherein the thermosetting resin composition contains an epoxy compound and a thermal catalyst-type curing agent, wherein each of the conductive particles is a light-reflective conductive particle including a core particle coated with a metal material and a light reflecting layer disposed on a surface of the core particle and formed of at least one type of inorganic particle selected from titanium oxide particles, zinc oxide particles, and aluminum oxide particles.
A light-reflective anisotropic conductive paste used to connect a light-emitting element to a wiring board by anisotropic conductive connection, the light-reflective anisotropic conductive paste comprising a thermosetting resin composition, conductive particles, and light-reflective insulating particles, the conductive particles and the light-reflective insulating particles being dispersed in the thermosetting resin composition, wherein the thermosetting resin composition contains an epoxy compound and a thermal catalyst-type curing agent, and each of the light-reflective insulating particles is titanium oxide.
An anisotropic conductive paste used to connect a light-emitting element to a wiring board by anisotropic conductive connection, the anisotropic conductive paste comprising a thermosetting resin composition, conductive particles, and light-reflective insulating particles being dispersed in the thermosetting resin composition, wherein the thermosetting resin composition contains an epoxy compound and a thermal catalyst-type curing agent, and the anisotropic conductive paste has a light reflectivity of 30% or higher to a wavelength of 40 nm.
Dependencies are inferred from the claim text.