Die packages and systems having the die packages
AssigneeSamsung Electronics Co., Ltd.
InventorsHyun-Joong Kim, Jang Seok Choi, Chul-Hwan Choo
Life of this patent
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Abstract
A die package may include a package substrate; an interposer; and/or at least one first die connected between the package substrate and the interposer. The die package may further include at least one second die mounted on the interposer and/or a processor. A system may include a system board and/or a die package mounted on the system board. The die package may include a package substrate; an interposer; and/or at least one first die connected between the package substrate and the interposer. The system may further include at least one second die mounted on the interposer and/or a processor. The processor may control data processing operations of the at least one first die and/or the at least one second die.
Claims20
A die package, comprising:
- a package substrate;
- an interposer;
- at least one first die connected between the package substrate and the interposer;
- at least one second die mounted on the interposer;
- and
- a processor mounted on the interposer and separated from the at least one second die;
- wherein the at least one first die and the at least one second die are overlapped in a vertical direction, and
- wherein the at least one first die and the processor are not overlapped in the vertical direction.
A system, comprising:
- a system board;
- and
- a die package mounted on the system board;
- wherein the die package includes:
- a package substrate;
- an interposer;
- at least one first die connected between the package substrate and the interposer;
- at least one second die mounted on the interposer;
- and
- a processor mounted on the interposer and separated from the at least one second die;
- wherein the processor controls data processing operations of the at least one first die and the at least one second die,
- wherein the at least one first die and the at least one second die are overlapped in a vertical direction, and
- wherein the at least one first die and the processor are not overlapped in the vertical direction.
A die package, comprising:
- a package substrate;
- at least one first die on the package substrate;
- an interposer stacked on the at least one first die and electrically connected to the at least one first die through first microbumps;
- and
- at least one second die stacked on the interposer and electrically connected to the at least one first die through second microbumps;
- wherein the at least one second die is stacked on the at least one first die through the interposer, and
- wherein the at least one first die and the at least one second die are entirely overlapped in a vertical direction.
Dependencies are inferred from the claim text.