Semiconductor device and manufacturing method thereof
AssigneeKabushiki Kaisha Toshiba
InventorsSatoshi Tsukiyama, Masatoshi Fukuda, Hiroshi Watabe, Keita Mizoguchi, Naoyuki Komuta
Life of this patent
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Abstract
In one embodiment, a semiconductor device includes a first semiconductor chip and a second semiconductor chip stacked on the first semiconductor chip. The first and second semiconductor chips are electrically connected via first bump connection parts. Stopper projections and bonding projections are provided at least one of the first and second semiconductor chips. The stopper projections are in contact with the other of the first and second semiconductor chips in an unbonded state. The bonding projections are bonded to the first and second semiconductor chips.
Claims10
A semiconductor device, comprising:
- a first semiconductor chip having a first surface including a first electrical connection region and a first non-connection region excluding the first electrical connection region;
- a second semiconductor chip having a second surface including a second electrical connection region facing the first electrical connection region and a second non-connection region excluding the second electrical connection region, and stacked on the first semiconductor chip;
- first bump connection parts provided between the first electrical connection region of the first surface and the second electrical connection region of the second surface to electrically connect between the first semiconductor chip and the second semiconductor chip;
- first stopper projections locally formed on at least one region of the first non-connection region of the first surface and the second non-connection region of the second surface, and being in contact with the other region of the first non-connection region and the second non-connection region in an unbonded state;
- first bonding projections locally provided between the first non-connection region of the first surface and the second non-connection region of the second surface, and bonded to the first and second surfaces non-connection regions;
- and
- a first resin filled into a gap between the first surface of the first semiconductor chip and the second surface of the second semiconductor chip.
A semiconductor device, comprising:
- a first semiconductor chip having a first surface including a first electrical connection region and a first non-connection region excluding the first electrical connection region;
- a second semiconductor chip having a second surface including a second electrical connection region facing the first electrical connection region and a second non-connection region excluding the second electrical connection region, and stacked on the first semiconductor chip;
- first bump connection parts provided between the first electrical connection region of the first surface and the second electrical connection region of the second surface to electrically connect the first semiconductor chip and the second semiconductor chip;
- first stopper and bonding projections locally formed on at least one region of the first non-connection region of the first surface and the second non-connection region of the second surface, and bonded to the other region of the first non-connection region and the second non-connection region;
- and
- a first resin filled into a gap between the first surface of the first semiconductor chip and the second surface of the second semiconductor chip.
Dependencies are inferred from the claim text.