Wafer level package and fabrication method
AssigneeAmkor Technology, Inc.
InventorsRonald Patrick Huemoeller, Sukianto Rusli, David Razu
Life of this patent
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Abstract
A method of forming an electronic component package includes coupling a first surface of an electronic component to a first surface of a first dielectric strip, the electronic component comprising bond pads on the first surface; forming first via apertures through the first dielectric strip to expose the bond pads; and filling the first via apertures with an electrically conductive material to form first vias electrically coupled to the bond pads. The bond pads are directly connected to the corresponding first vias without the use of a solder and without the need to form a solder wetting layer on the bond pads.
Claims20
An electronic component package comprising:
- an electronic component comprising a first surface comprising a bond pad;
- a dielectric strip comprising a first surface coupled to the first surface of the electronic component;
- a via extending through the dielectric strip and being coupled to the bond pad;
- a trace coupled to a second surface of the dielectric strip and coupled to the via;
- and
- an encapsulant encapsulating and directly contacting a second surface and sides of the electronic component.
An electronic component package comprising:
- an electronic component comprising a first surface comprising a bond pad;
- a first dielectric strip comprising a first surface coupled to the first surface of the electronic component;
- a via extending through the first dielectric strip and being coupled to the bond pad;
- a trace on a second surface of the first dielectric strip and coupled to the via;
- a second dielectric strip coupled to the first dielectric strip;
- and
- an encapsulant encapsulating and directly contacting a second surface and sides of the electronic component.
A method of forming an electronic component package comprising:
- forming an assembly, the assembly comprising:
- an electronic component comprising a first surface comprising bond pads thereon;
- an encapsulant encapsulating the entire electronic component except the first surface of the electronic component;
- and
- a first dielectric strip comprising a first surface coupled to the first surface of the electronic component including the bond pads;
- forming vias extending through the first dielectric strip and being coupled to the bond pads;
- and
- forming traces on a second surface of the first dielectric strip and coupled to the vias.
Dependencies are inferred from the claim text.