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US 8,710,646 B2Granted
Power module
AssigneeMitsubishi Electric Corporation
InventorsShintaro Araki, Korehide Okamoto, Khalid Hassan Hussein, Mitsunori Aiko
Life of this patent
Estimating the term…
Abstract
A power module includes a first semiconductor device having a collector terminal and an emitter terminal which extend outwardly from a molded resin, wherein at least one of the collector and emitter terminals is a bilaterally extending terminal extending outwardly from two opposite surfaces of the molded resin, and a second semiconductor device having the same construction as the first semiconductor device. The bilaterally extending terminal of the first semiconductor device is connected to a bilaterally extending terminal of the second semiconductor device.
Claims4
A power module comprising:
- a first semiconductor device having a collector terminal and an emitter terminal which extend outwardly from a molded resin, wherein at least one of said collector and emitter terminals is a bilaterally extending terminal extending outwardly from two opposite surfaces of said molded resin;
- a second semiconductor device having the same construction as said first semiconductor device;
- wherein said bilaterally extending terminal of said first semiconductor device is connected to a bilaterally extending terminal of said second semiconductor device, and
- a third semiconductor device having an emitter terminal and a collector terminal, said emitter terminal being a bilaterally extending terminal extending outwardly from two opposite surfaces of a molded resin, said collector terminal extending outwardly from said molded resin,
- wherein said bilaterally extending terminal of said first semiconductor device is said collector terminal, and
- wherein said emitter terminal of said first semiconductor device is connected to said collector terminal of said third semiconductor device.
3 more elements
A power module comprising:
- a first semiconductor device having a collector terminal and an emitter terminal which extend outwardly from a molded resin, wherein at least one of said collector and emitter terminals is a bilaterally extending terminal extending outwardly from two opposite surfaces of said molded resin;
- a second semiconductor device having the same construction as said first semiconductor device;
- wherein said bilaterally extending terminal of said first semiconductor device is connected to a bilaterally extending terminal of said second semiconductor device, wherein:
- said first semiconductor device includes an arm including two power semiconductor elements connected in series;
- said collector terminal is a P line serving as a high voltage line of said arm;
- said emitter terminal is an N line serving as a low voltage line of said arm;
- and
- said P line and said N line are said bilaterally extending terminals.
5 more elements
A power module comprising:
- a first semiconductor device having a collector terminal and an emitter terminal which extend outwardly from a molded resin, wherein at least one of said collector and emitter terminals is a bilaterally extending terminal extending outwardly from two opposite surfaces of said molded resin;
- a second semiconductor device having the same construction as said first semiconductor device;
- wherein said bilaterally extending terminal of said first semiconductor device is connected to a bilaterally extending terminal of said second semiconductor device, wherein:
- said first semiconductor device includes an arm including two power semiconductor elements connected in series;
- and
- a neutral terminal of said arm extends outwardly from directly above a neutral point of said arm within said molded resin.
3 more elements
A power module comprising:
- a first semiconductor device having a collector terminal and an emitter terminal which extend outwardly from a molded resin, wherein at least one of said collector and emitter terminals is a bilaterally extending terminal extending outwardly from two opposite surfaces of said molded resin;
- a second semiconductor device having the same construction as said first semiconductor device;
- wherein said bilaterally extending terminal of said first semiconductor device is connected to a bilaterally extending terminal of said second semiconductor device, wherein:
- said first semiconductor device constitutes the upper arm or lower arm, or both, of an arm including two power semiconductor elements connected in series;
- and
- a neutral terminal between said two power semiconductor elements is a bilaterally extending terminal.
3 more elements
Dependencies are inferred from the claim text.