Semiconductor unit having a power semiconductor and semiconductor apparatus using the same
AssigneeFuji Electric Co., Ltd.
InventorKenichiro Sato
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AssigneeFuji Electric Co., Ltd.
InventorKenichiro Sato
Estimating the term…
A semiconductor unit of certain aspects of the invention includes electrically conductive plates in the shape of the letter L, each consisting of a horizontally disposed leg portion and a vertically disposed flat body portion that is perpendicular to a cooling plate adhered to the bottom of the semiconductor unit. A pair of the vertically disposed flat body portions sandwiches a semiconductor chip. Owing to this construction, the heat generated in the semiconductor chip can be conducted away through the both surfaces of the chip, thus improving cooling performance. Since the heat is conducted away through the leg portions of the L-shaped electrically conductive plates a projected planar area occupied by the cooling plate required for cooling the semiconductor unit is reduced. Therefore, the size of the semiconductor unit can be reduced.
A semiconductor unit comprising:
A semiconductor apparatus comprising:
Dependencies are inferred from the claim text.