Integrated circuit packaging system with heat slug and method of manufacture thereof

A method of manufacture of an integrated circuit packaging system comprising:

• mounting an integrated circuit over a package carrier;
• mounting a conductive connector over the package carrier;
• forming an encapsulation over the integrated circuit, the encapsulation having a recess exposing the conductive connector;
• and
• mounting a heat slug over the encapsulation, the heat slug having:
• an opening with an opening width greater than a recess width of the recess, the opening exposing a portion of a top surface of the encapsulation and the conductive connector,
• a teeth gap exposing a bottom connector, and
• a teeth extension of the heat slug covering a bottom gap between a plurality of the bottom conductive connector.

An integrated circuit packaging system comprising:

• a package carrier;
• an integrated circuit over the package carrier;
• a conductive connector over the package carrier;
• an encapsulation over the integrated circuit, the encapsulation having a recess exposing the conductive connector;
• a heat slug over the encapsulation, the heat slug having an opening with an opening width greater than a recess width of the recess, the opening exposing a portion of a top surface of the encapsulation;
• a bottom conductive connector attached to the package carrier;
• and
• wherein the heat slug includes:
• a teeth gap exposing the bottom conductive connector;
• and
• a teeth extension covering the bottom gap between a plurality of the bottom conductive connector.