Integrated circuit packaging system with an integral-interposer-structure and method of manufacture thereof
AssigneeSTATS ChipPAC, Ltd.
InventorsHeeJo Chi, Jae Han Chung, Junwoo Myung, Yeonglm Park, HyungMin Lee
Life of this patent
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Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a substrate having a substrate-interconnect; mounting an integrated circuit above and to the substrate; mounting an internal interconnect to the substrate-interconnect; mounting a structure having an integral-interposer-structure over the substrate and over the integrated circuit with the integral-interposer-structure connected to the internal interconnect; and encapsulating the internal interconnect and the integrated circuit with an encapsulation.
Claims12
A method of manufacture of an integrated circuit packaging system comprising:
- providing a substrate having a plurality of substrate-interconnects;
- mounting a plurality of internal interconnects to and over the plurality of substrate-interconnects;
- mounting an integrated circuit above the substrate and the plurality of substrate-interconnects, the integrated circuit adjacent to and between the plurality of internal interconnects;
- mounting an interposer having an integral-interposer-structure over the substrate, the plurality of substrate-interconnects, the integrated circuit and the plurality of internal interconnects, the integral-interposer-structure extending past peripheral sides of the integrated circuit and electrically connected to the plurality of internal interconnects, wherein mounting the interposer includes mounting an integral-conductive-shield having a hole;
- embedding a die in the integral-interposer-structure between a top surface and a bottom surface of the integral-interposer-structure;
- and
- forming an encapsulation encapsulating the plurality of internal interconnects and the integrated circuit.
An integrated circuit packaging system comprising:
- a substrate having a plurality of substrate-interconnects;
- a plurality of internal interconnects mounted to and over the plurality of substrate-interconnects;
- an integrated circuit mounted above the substrate and the plurality of substrate-interconnects, the integrated circuit adjacent to and between the plurality of internal interconnects;
- an interposer having an integral-interposer-structure mounted over the substrate, the plurality of substrate-interconnects, the integrated circuit and the plurality of internal interconnects, the integral-interposer-structure extending past peripheral sides of the integrated circuit and electrically connected to the plurality of internal interconnects, the integral-interposer-structure having a die embedded in the integral-interposer-structure between a top surface and a bottom surface of the integral-interposer-structure, wherein the integral-interposer-structure is an integral-conductive-shield having a hole;
- and
- an encapsulation encapsulating the plurality of internal interconnects and the integrated circuit.
Dependencies are inferred from the claim text.