Surface modification
AssigneeCambridge Display Technology Limited
InventorThomas Kugler
Life of this patent
Estimating the term…
Abstract
A method of modifying a fluorinated polymer surface comprising the steps of depositing a first layer on at least a portion of the fluorinated polymer surface, the first layer comprising a first polymer, the first polymer being a substantially perfluorinated aromatic polymer; and depositing a second layer on at least a portion of the first layer, the second layer comprising a second polymer, the second polymer being an aromatic polymer having a lower degree of fluorination than said first polymer, whereby the second layer provides a surface on to which a substance having a lower degree of fluorination than the first polymer, e.g. a non-fluorinated substance is depositable.
Claims56
A method of modifying a fluorinated polymer surface comprising the steps of:
- depositing a first layer on at least a portion of a fluorinated polymer surface, the first layer comprising a first polymer, the first polymer being a substantially perfluorinated aromatic polymer, wherein the first layer is deposited using a solution deposition technique;
- and
- depositing a second layer on at least a portion of the first layer, the second layer comprising a second polymer, the second polymer being an aromatic polymer having a lower degree of fluorination than said first polymer, whereby the second layer provides a surface on to which a substance having a lower degree of fluorination than the first polymer is depositable,
- wherein the first polymer is dissolved in a first solvent system comprising a fluorinated solvent and a non-fluorinated solvent and the ratio of fluorinated solvent:non-fluorinated solvent in the first solvent system is 5-1:1-5.
An electronic device comprising:
- an insulating layer containing a fluorinated polymer;
- a first layer covering at least a portion of the insulating layer, the first layer comprising a first polymer which comprises a substantially perfluorinated aromatic polymer;
- a second layer covering at least a portion of the first layer and comprising a second polymer having a lower degree of fluorination than the first polymer;
- and
- at least one portion comprising a non-fluorinated substance;
- a third layer between the second layer and the or each one portion comprising a non-fluorinated substance;
- wherein the first layer and the second layer together make up at least part of an adhesion layer between the insulating layer and the or each portion comprising the non-fluorinated substance and the third layer comprises a third polymer having lower conjugation and/or greater polarity than the second polymer.
An electronic device comprising:
- an insulating layer containing a fluorinated polymer;
- a first layer covering at least a portion of the insulating layer, the first layer comprising a first polymer which comprises a substantially perfluorinated aromatic polymer;
- a second layer covering at least a portion of the first layer and comprising a second polymer having a lower degree of fluorination than the first polymer;
- and
- at least one portion comprising a non-fluorinated substance;
- wherein the first layer and the second layer together make up at least part of an adhesion layer between the insulating layer and the or each portion comprising the non-fluorinated substance, wherein the first polymer is selected from the group consisting of poly(pentafluorostyrene-co-glycidylmethacrylate), poly(pentafluorostyrene), and polystyrene-co-pentafluoro styrene.
A method of manufacturing an electronic device, wherein the electronic device comprises an insulating layer having a fluorinated polymer surface, the method comprising:
- depositing a first layer on to at least a portion of the fluorinated polymer surface, the first layer comprising a first polymer, the first polymer being a substantially perfluorinated aromatic polymer;
- depositing a second layer covering at least a portion of the first layer and comprising a second polymer, the second polymer being an aromatic polymer having a lower degree of fluorination than the first polymer, wherein the first layer and the second layer together make up at least part of an adhesion layer between the insulating layer and a non-fluorinated substance;
- and
- depositing at least one compound containing a non-fluorinated substance on to at least a portion of the adhesion layer, wherein the first polymer is selected from the group consisting of poly(pentafluorostyrene-co-glycidylmethacrylate), poly(pentafluorostyrene) and polystyrene-co-pentafluoro styrene.
A method of depositing a fluorine-containing polymer onto a fluorinated surface, the method comprising:
- dissolving the fluorine-containing polymer in a solvent mixture containing a fluorinated solvent species and a non-fluorinated solvent species;
- and
- contacting the dissolved fluorine-containing polymer with the fluorinated surface to form a layer of the fluorine-containing polymer on the fluorinated surface,
- wherein the non-fluorinated solvent species has a lower boiling point than the fluorinated solvent species.
Dependencies are inferred from the claim text.