Integrated circuit having a discrete capacitor mounted on a semiconductor die
AssigneeXilinx, Inc.
InventorsRomi Mayder, Mark A. Alexander, Howard Johnson
Life of this patent
Estimating the term…
Abstract
Integrated circuits are fabricated with mounted discrete capacitors. Bond pads and land pads are fabricated on a semiconductor wafer. Discrete capacitors are mounted on the semiconductor wafer with flexible adhesive. The flexible adhesive accommodates a difference in thermal expansion between the discrete capacitors and the semiconductor wafer. The land pads are electrically coupled to the electrodes of the discrete capacitors. The semiconductor wafer is separated into multiple semiconductor dice. The semiconductor dice are mounted in respective packages. The bond pads on each semiconductor die are electrically coupled to the interconnect terminals of the respective package.
Claims12
An integrated circuit, comprising:
- a semiconductor die;
- wherein the semiconductor die has first and second surfaces;
- at least one discrete capacitor mounted on the semiconductor die;
- wherein the at least one discrete capacitor is mounted on the first surface of the semiconductor die;
- two electrodes for each discrete capacitor;
- two flexible adhesive connections for each discrete capacitor, each of the two flexible adhesive connections connecting the discrete capacitor to one of the two electrodes for the discrete capacitor;
- wherein the two flexible adhesive connections accommodate a difference in thermal expansion between the discrete capacitor and the semiconductor die;
- a plurality of bond pads and a plurality of land pads disposed on the semiconductor die, wherein the land pads include two land pads for each discrete capacitor;
- two solder connections for each discrete capacitor, each of the two solder connections connected to, and between, one of the two electrodes for the discrete capacitor and one of the two land pads for the discrete capacitor;
- and
- a package arrangement electrically coupling the plurality of bond pads to a plurality of interconnect terminals of the package arrangement;
- wherein the package arrangement is attached to the semiconductor die at the second surface of the semiconductor die.
An integrated circuit, comprising:
- a semiconductor die;
- wherein the semiconductor die has first and second surfaces;
- at least one discrete capacitor mounted on the semiconductor die;
- wherein the at least one discrete capacitor is mounted on the first surface of the semiconductor die;
- two electrodes for each discrete capacitor, the two electrodes disposed on the discrete capacitor;
- a flexible adhesive connection for each discrete capacitor, the flexible adhesive connection connecting the discrete capacitor to the semiconductor die;
- wherein the flexible adhesive connection accommodates a difference in thermal expansion between the discrete capacitor and the semiconductor die;
- a plurality of bond pads and a plurality of land pads disposed on the semiconductor die, wherein the plurality of land pads include two land pads for each discrete capacitor;
- two wire bond connections for each discrete capacitor, the two wire bond connections connecting the two electrodes for the discrete capacitor to the two land pads for the discrete capacitor;
- and
- a package arrangement electrically coupling the plurality of bond pads to a plurality of interconnect terminals of the package arrangement;
- wherein the package arrangement is attached to the semiconductor die at the second surface of the semiconductor die.
Dependencies are inferred from the claim text.