Defected ground plane inductor
AssigneeHarris Corporation
InventorDavid M. Smith
Life of this patent
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AssigneeHarris Corporation
InventorDavid M. Smith
Estimating the term…
An spiral inductor (300) formed on a semiconductor substrate (102). One or more insulating layers (104, 303) is disposed on a first surface of the semiconductor substrate. A spiral structure (106) is formed of a first conductive material layer disposed on the insulating layer. The spiral structure has a terminal end (105) at a location enclosed by one or more coils of the spiral. A ground plane (302) is formed of a second conductive material and disposed on a second surface located on a side of the substrate opposed from the first surface. The ground plane is defected so as to define a signal trace (308) formed from a portion of the ground plane. A conductive via (304) extends through the one or more insulating layers, and through the semiconductor substrate, to form an electrical connection between the ground plane and the terminal end.
An inductor, comprising:
A semiconductor integrated circuit comprising:
Dependencies are inferred from the claim text.