Fibrous laminate interface for security coatings
AssigneeHoneywell International Inc.
InventorsKenneth H. Heffner, William J. Dalzell, Kara L. Warrensford
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Abstract
An integrated circuit (IC) package with a fibrous interface is provided. The package includes a substrate, a bond coat and a top coat. The substrate is configured to contain IC components and connections. The bond coat layer is configured to encapsulate the IC components. The top coat layer has at least a portion embedded in the bond coat layer. Moreover, the top coat layer includes a fibrous interface configured to provide security and strengthen the bond coat layer.
Claims7
An integrated circuit (IC) package, the package comprising:
- a substrate configured to contain IC components and connections;
- a bond coat layer configured to encapsulate the IC components;
- and
- a top coat layer having at least a portion embedded into the bond coat layer prior to fully curing the bond coat layer, the top coat layer including a fibrous interface configured to provide security and strengthen the bond coat layer.
An integrated circuit (IC) package, the package comprising:
- a substrate configured to contain IC components and connections;
- an uncured bond coat layer configured to encapsulate the IC components;
- and
- a top coat layer having at least a portion embedded into the uncured bond coat layer, the top coat layer including a fibrous interface configured to provide security and strengthen the bond coat layer.
Dependencies are inferred from the claim text.