Method and apparatus for image sensor packaging

An integrated circuit (IC) package, comprising:

• a sensor device comprising
• a substrate with a front side and a backside;
• a photosensitive diode within an active area of the substrate;
• and
• a first bond pad array at the front side of the substrate, wherein the first bond pad array comprises a first bond pad and a second bond pad separated by an opening and electrically connected to each other, and every electrical component connected to the first bond pad is also electrically connected to the second bond pad;
• an ASIC chip comprising
• a substrate, and a second bond pad array at a front side of the substrate, wherein the second bond pad array comprises a third bond pad and a fourth bond pad separated by an opening and electrically connected to each other, and functioning as one electric contact;
• the first bond pad of the first bond pad array and the third bond pad of the second bond pad array are directly bonded together.