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US 8,710,601 B2Granted
MEMS structure and method for making the same
AssigneeUnited Microelectronics Corp.
InventorsChien-Hsin Huang, Bang-Chiang Lan, Ming-I Wang, Hui-Min Wu, Tzung-I Su, Chao-An Su, Tzung-Han Tan, Min Chen, Meng-Jia Lin
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Abstract
A micro electro mechanical system (MEMS) structure is disclosed. The MEMS structure includes a backplate electrode and a 3D diaphragm electrode. The 3D diaphragm electrode has a composite structure so that a dielectric is disposed between two metal layers. The 3D diaphragm electrode is adjacent to the backplate electrode to form a variable capacitor together.
Claims17
A micro electro mechanical system (MEMS) structure, comprising:
- a backplate electrode;
- and
- a 3D diaphragm electrode comprising:
- a first metal layer with at least a concave trench structure, wherein the thickness of the bottom of said concave trench structure and the thickness of the sidewall of said concave trench structure are different;
- at least a spacer formed at the sidewall of the concave trench structure;
- and
- a second metal layer conformally formed on and covering the surface of the first metal layer and the spacer.
4 more elements
A micro electro mechanical system (MEMS) structure, comprising:
- a backplate electrode;
- and
- a 3D diaphragm electrode comprising:
- a first metal layer with at least a substantially U-shaped concave trench structure;
- at least a spacer formed at the sidewall of the concave trench structure;
- and
- a second metal layer conformally formed on and directly contacting the surface of the first metal layer and the spacer.
4 more elements
Dependencies are inferred from the claim text.