Semiconductor pressure sensor
AssigneeMitsubishi Electric Corporation
InventorsEiji Yoshikawa, Shinichi Izuo
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AssigneeMitsubishi Electric Corporation
InventorsEiji Yoshikawa, Shinichi Izuo
Estimating the term…
A semiconductor pressure sensor that can improve diaphragm breakage pressure tolerance is provided. Included are: a first semiconductor substrate on which is formed a recess portion that has an opening on a first surface in a thickness direction; a second semiconductor substrate that is disposed so as to face the first surface of the first semiconductor substrate; and a first silicon oxide film that is interposed between the first semiconductor substrate and the second semiconductor substrate, and on which is formed a penetrating aperture that communicates between the recess portion and the second semiconductor substrate, and at least a portion of an edge portion of the penetrating aperture is positioned inside an opening edge portion of the recess portion when viewed from a side facing the penetrating aperture and the opening of the recess portion.
A semiconductor pressure sensor comprising:
Dependencies are inferred from the claim text.