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US 8,710,596 B2Granted
Semiconductor device
AssigneeUnited Microelectronics Corp.
InventorChing-Wen Hung
Life of this patent
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Abstract
A semiconductor device is disclosed. The semiconductor device includes: a substrate having a region; a gate structure disposed on the region of the substrate; a raised epitaxial layer disposed in the substrate adjacent to two sides of the gate structure, wherein the surface of the raised epitaxial layer is even with the surface of the gate structure.
Claims5
A semiconductor device, comprising:
- a substrate having a PMOS region and a shallow trench isolation (STI);
- a gate structure disposed on the PMOS region of the substrate, wherein the gate structure comprises a spacer;
- a raised epitaxial layer disposed in the substrate adjacent to two sides of the gate structure, wherein the top surface of the raised epitaxial layer comprising silicon germanium is even with the top surface of the gate structure and the top surface of the spacer, and higher than the top surface of the STI;
- and
- a cap layer on the STI, wherein the top surface of the cap layer is even with the top surface of the raised epitaxial layer.
2 more elements
Dependencies are inferred from the claim text.