Radiation-emitting semiconductor chip and method for producing a radiation-emitting semiconductor chip

A radiation-emitting semiconductor chip comprising:

• a carrier and
• a semiconductor body with a semiconductor layer sequence comprising an active region that generates radiation, a first semiconductor layer and a second semiconductor layer;
• wherein the active region is arranged between the first semiconductor layer and the second semiconductor layer;
• the first semiconductor layer is arranged on a side of the active region which faces away from the carrier;
• the semiconductor body comprises at least one recess which extends through the active region and does not extend completely through the first semiconductor layer;
• the first semiconductor layer is electrically conductively connected to a first connection layer extending in the recess from the first semiconductor layer in a direction of the carrier;
• the first connection layer is electrically connected to the second semiconductor layer via a protective diode;
• and
• the active region completely covers the protective diode in a plan view of the chip.

A radiation-emitting semiconductor chip comprising:

• a carrier and
• a semiconductor body with a semiconductor layer sequence comprising an active region that generates radiation, a first semiconductor layer and a second semiconductor layer;
• wherein the active region is arranged between the first semiconductor layer and the second semiconductor layer;
• the first semiconductor layer is arranged on a side of the active region which faces away from the carrier;
• the semiconductor body comprises at least one recess which extends through the active region;
• the first semiconductor layer is electrically conductively connected to a first connection layer extending in the recess from the first semiconductor layer in a direction of the carrier;
• an entire radiation exit area of the semiconductor body facing away from the carrier is free of electrical contact material that is opaque to radiation generated in the active region;
• the first connection layer is electrically connected to the second semiconductor layer via a protective diode;
• and
• the active region completely covers the protective diode in a plan view of the chip.