Light-emitting diode devices

A light-emitting diode device, comprising:

• a die carrier having a die mounting surface and a plurality of electrical connection regions electrically insulated from one another;
• a light-emitting diode (LED) die mounted on the die mounting surface of the die carrier, wherein the LED die comprises a substrate, a first type semiconductor layer disposed under the substrate and provided with a conductive island, a second type semiconductor layer disposed under the first type semiconductor layer without shielding the conductive island of the first type semiconductor layer and provided with a conductive island, and an another first type semiconductor layer disposed under the second type semiconductor layer without shielding the conductive island of the second type semiconductor layer and provided with a conductive island;
• a reflective layer disposed under the semiconductor layers and formed with a plurality of through holes to expose the conductive islands;
• an insulative layer disposed under the reflective layer and formed with a plurality of via holes registered with the corresponding through holes;
• a plurality of electrically conductive linkers, each extending from a corresponding one of the conductive islands along a corresponding one of the through holes and the via hole registered with the corresponding through hole and protruding outwardly from the insulative layer for electrical connection to a corresponding one of the electrical connection regions of the die carrier;
• and a light transmissible protective layer formed on the die mounting surface of the die carrier in a manner covering the LED die.

A light-emitting diode device, comprising:

• a the die carrier comprising a first surface, a second surface opposite to the first surface, a plurality of vias connecting the first surface to the second surface, and a plurality of anchor seats formed on the second surface of the die carrier along peripheries of the respective vias;
• a light-emitting diode (LED) die comprising a substrate, a first type semiconductor layer disposed under the substrate and provided with a conductive island at a predetermined position, a second type semiconductor layer disposed under the first type semiconductor layer without shielding the conductive island of the first type semiconductor layer and provided with a conductive island at a predetermined position;
• a reflective layer disposed under surfaces of the semiconductor layers and formed with a plurality of through holes to expose the conductive islands;
• an adhesive insulative layer disposed on the reflective layer and formed with a plurality of via holes registered with the corresponding through holes;
• a plurality of electrically conductive linkers, each extending from a corresponding one of the conductive islands to a corresponding one of the anchor seats along a corresponding one of the through holes, a corresponding one of the via holes and a corresponding one of the vias;
• and
• a light transmissible protective layer formed on the first surface of the die carrier in a manner covering the LED die.