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US 8,710,529 B2Granted
Light-emitting device package structure
AssigneeEverlight Electronics Co., Ltd.
InventorsYing-Zhong Chen, Chih-Hung Hsu, Chia-Yun Hsu
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Abstract
A light-emitting device package structure includes a leadframe, a light-emitting device disposed on the leadframe, a plurality of wires electrically connecting the leadframe and the light-emitting device, and an encapsulant covering the light-emitting device, the wires and a part of the leadframe. The encapsulant has a gas space therein, and the gas space is disposed on the light-emitting device, wherein the gas space includes at least one gas.
Claims19
A light-emitting device package structure, comprising:
- a light-emitting device having a main luminous surface;
- and
- an encapsulant, the encapsulant encapsulating the light-emitting device and comprising:
- a first encapsulated portion;
- a second encapsulated portion covering a part of the first encapsulated portion such that a gas space is disposed between the first encapsulated portion and the second encapsulated portion;
- and
- at least one gas in the gas space,
- wherein an outer surface of the first encapsulated portion facing away from the light-emitting device has a concavity that forms a hollow to accommodate the gas space.
5 more elements
Dependencies are inferred from the claim text.