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US 8,710,523 B2Granted
Device chip carriers, modules, and methods of forming thereof
AssigneeE. I. Du Pont de Nemours and Company
InventorsJoel Slutsky, Brian D. Veeder, Thomas Lin
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Abstract
The present invention provides novel methods of forming component carriers, component modules, and the carriers and modules formed therefrom which utilize thick film technology. In some embodiments, these methods are used to form lighting device chip carriers and modules. In further embodiments, these lighting device chip carriers and modules are used in LED applications.
Claims18
A method of forming a chip carrier comprising:
- providing a base material having lower and upper opposing surfaces;
- providing a dielectric thick film composition comprising 3% ethyl cellulose, 4% terpineol, 4% dibuyl phthalate, 85% inorganic phase in weight percent of the composition;
- applying said dielectric thick film composition to said upper surface of said base material;
- firing said dielectric thick film composition and said base material at a firing temperature such that the dielectric forms a glass/ceramic composite, thus forming a structure comprising a fired base layer and a fired dielectric layer;
- and
- applying a conductive layer at least partially covering said dielectric layer, and wherein said base material upper surface is oxidized,
- wherein the fired film has no conductivity.
4 more elements
A method of forming a chip carrier comprising:
- providing a base material having lower and upper opposing surfaces and oxidizing said base material upper surface;
- providing a dielectric thick film composition;
- applying said dielectric thick film composition to said upper surface of said base material;
- firing said dielectric thick film composition and said base material at a firing temperature in the range of 450° C. to 600° C. wherein the dielectric forms a glass/ceramic composite, thus forming a structure comprising a fired base layer and a fired dielectric layer;
- applying a conductive layer at least partially covering said dielectric layer;
- firing said conductive layer;
- providing at least one component;
- applying a component attachment material to said dielectric layer;
- placing said component on said component attachment material;
- and
- connecting said component to said conductive layer;
- wherein the fired film has no conductivity.
9 more elements
Dependencies are inferred from the claim text.