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US 8,710,513 B2Granted
Light-emitting device package and method of manufacturing the same
AssigneeSamsung Electronics Co., Ltd.
InventorsCheol-jun Yoo, Young-hee Song
Life of this patent
Estimating the term…
Abstract
A light-emitting device package and a method of manufacturing the light-emitting device package. The light-emitting device package includes a wiring substrate; a Zener diode mounted on a first region of the wiring substrate; a light-emitting device chip mounted on the first region and a second region of the wiring substrate; and a molding member for fixing at least a portion of the wiring substrate, wherein the Zener diode is embedded in the molding member.
Claims25
A light-emitting device package comprising:
- a wiring substrate;
- a Zener diode mounted on a first region of the wiring substrate;
- a light-emitting device chip mounted on a second region of the wiring substrate, the second region being different from the first region;
- and
- a molding member for fixing at least a portion of the wiring substrate,
- wherein the Zener diode is embedded in the molding member.
3 more elements
A method of manufacturing a light-emitting device package, the method comprising:
- preparing a wiring substrate;
- disposing a Zener diode on a first region of the wiring substrate;
- disposing a light-emitting device chip on a second region of the wiring substrate, the second region being different from the first region;
- and
- forming a molding member so as to fix the wiring substrate,
- wherein the Zener diode is embedded in the molding member.
3 more elements
Dependencies are inferred from the claim text.