US 8,710,387 B2Granted

LED package chip classification system

AssigneeYoungtek Electronics Corporation

InventorsBily Wang, Kuei-Pao Chen, Hsin-Cheng Chen

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Abstract

An LED package chip classification system includes a rotation unit for transporting a plurality of LED package chips, a chip test unit, and a chip classification unit. The rotation unit includes a rotary turntable, a plurality of receiving portions formed on the rotary turntable, and a plurality of suction-exhaust dual-purpose openings respectively disposed in the receiving portions. Each LED package chip has a positive electrode pad and a negative electrode pad disposed on the bottom side thereof. The chip test unit includes a chip test module adjacent to the rotation unit for testing each LED package chip. The chip classification unit includes a plurality of chip classification modules adjacent to the rotation unit for classifying the LED package chips. Therefore, the LED package chips can be classified by matching the rotation unit, the chip test unit, and the chip classification unit.

Claims16

Dependent claims

An LED package chip classification system, comprising:

a rotation unit for transporting a plurality of LED package chips, wherein the rotation unit includes at least one rotary turntable, a plurality of receiving portions formed on the rotary turntable, and a plurality of suction-exhaust dual-purpose openings respectively disposed in the receiving portions, each receiving portion selectively receives at least one of the LED package chips, and each LED package chip has a positive electrode pad and a negative electrode pad disposed on the bottom side thereof;
a bearing unit including at least one bearing base, wherein the at least one rotary turntable is disposed on the at least one bearing base;
a chip test unit including at least one chip test module adjacent to the rotation unit for testing each LED package chip;
and
a chip classification unit including a plurality of chip classification modules adjacent to the rotation unit for classifying the LED package chips that have been tested by the at least one chip test module, wherein the chip classification modules surround the at least one rotary turntable;
a transportation unit including at least one transportation element adjacent to the rotary turntable for sequentially transporting each LED package chip to the corresponding receiving portion;
and
a chip position detection unit including a light emitting element disposed above the receiving portion adjacent to the at least one transportation element, and a chip position detection element disposed under the receiving portion corresponding to the light emitting element;
wherein light beams generated by the light emitting element are selectively projected onto the top surface of the LED package chip or transmitted to the chip position detection element through a through hole penetrating through the at least one bearing base and disposed under the receiving portion in order to judge whether the LED package chip is transmitted from the at least one transportation element to the receiving portion.

6 more elements

An LED package chip classification system, comprising:

a first rotation unit for transporting a plurality of LED package chips, wherein the first rotation unit includes at least one first rotary turntable, a plurality of first receiving portions formed on the first rotary turntable, and a plurality of first suction-exhaust dual-purpose openings respectively disposed in the first receiving portions, each first receiving portion selectively receives at least one of the LED package chips, and each LED package chip has a positive electrode pad and a negative electrode pad disposed on the bottom side thereof;
a chip test unit including at least one chip test module adjacent to the first rotation unit for testing each LED package chip;
a second rotation unit adjacent to the first rotation unit, wherein the second rotation unit includes at least one second rotary turntable, a plurality of second receiving portions formed on the second rotary turntable, and a plurality of second suction-exhaust dual-purpose openings respectively disposed in the second receiving portions, and each second receiving portion selectively receives at least one of the LED package chips transmitted from the first rotation unit;
a bearing unit including at least one bearing base, wherein the at least one first rotary turntable and the at least one second rotary turntable are disposed on the at least one bearing base;
a first chip classification unit including a plurality of first chip classification modules adjacent to the first rotation unit for classifying the LED package chips that have been tested by the at least one chip test module, wherein the first chip classification modules surround the at least one first rotary turntable;
and
a second chip classification unit including a plurality of second chip classification modules adjacent to the second rotation unit for classifying the LED package chips that have been tested by the at least one chip test module, wherein the second chip classification modules surround the at least one second rotary turntable.

4 more elements

Dependencies are inferred from the claim text.