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US 8,710,374 B2Granted
Printed wiring board with reinforced insulation layer and manufacturing method thereof
AssigneeIbiden Co., Ltd.
InventorsKiyotaka Tsukada, Takamichi Sugiura
Life of this patent
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Abstract
A printed wiring board is manufactured by a method in which a core substrate having an insulation substrate and a conductive circuit formed on the insulation substrate is provided. An inner insulation layer is formed on the core substrate, and a surface of the inner insulation layer is treated to form a roughened portion on the surface. An outer insulation layer including a reinforcing material is formed on the surface of the inner insulation layer having the roughened portion.
Claims21
A method for manufacturing a multilayer printed wiring board, comprising:
- providing a core substrate having an insulation substrate and a conductive circuit provided on the insulation substrate;
- forming a first inner insulation layer on a first surface of the core substrate;
- forming a second inner insulation layer on a second surface of the core substrate opposite to the first surface;
- roughening surfaces of the first inner insulation layer and the second inner insulation layer;
- forming a first outer insulation layer on the first inner insulation layer such that a first build-up structure comprising the first outer insulation layer and the first inner insulation layer provided between the first outer insulation layer and the core substrate is formed;
- forming a second outer insulation layer on the second inner insulation layer such that a second build-up structure comprising the second outer insulation layer and the second inner insulation layer provided between the second outer insulation layer and the core substrate is formed;
- and
- forming a solder-resist layer on at least one of the first outer insulation layer and the second outer insulation layer,
- wherein the insulation substrate, the first outer insulation layer and the second outer insulation layer comprise a reinforcing material, the first inner insulation layer and the second inner insulation layer are free from a reinforcing material, and the first build-up structure and the second build-up structure are formed such that the first and second build-up structures have a same number of insulation layers.
6 more elements
A multilayer printed wiring board, comprising:
- a core substrate having an insulation substrate and a conductive circuit provided on the insulation substrate, the core substrate having a first surface and a second surface opposite to the first surface;
- a first build-up structure provided on the first surface of the core substrate, the first build-up structure comprising a first inner insulation layer provided between a first outer insulation layer and the core substrate;
- and
- a second build-up structure provided on the second surface of the core substrate, the second build-up structure comprising a second inner insulation layer provided between a second outer insulation layer and the core substrate;
- and
- a solder-resist layer formed on at least one of the first outer insulation layer and the second outer insulation layer,
- wherein the insulation substrate, the first outer insulation layer and the second outer insulation layer comprise a reinforcing material, the first inner insulation layer and the second inner insulation layer are free from a reinforcing material, the first inner insulation layer and the second inner insulation layer have roughened surfaces, and the first build-up structure and the second build-up structure are formed such that the first and second build-up structures have a same number of insulation layers.
4 more elements
Dependencies are inferred from the claim text.