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US 8,709,945 B2Granted
Area efficient through-hole connections
OwnerJeng-Jye Shauinventor
Life of this patent
Estimating the term…
Abstract
Using printing technologies to fill conductor materials into holes in silicon substrate, the preferred embodiments of the present improve cost efficiency of through-hole connections. Using silicon substrate as cathode terminal during electrical plating that fill holes in a silicon substrate with conductors, the preferred embodiments of the present improve alignment accuracy and cost efficiency of through-hole manufacturing processes.
Claims12
A method for providing electrical connection(s) through a silicon substrate, comprising the steps of:
- opening a hole into the silicon substrate;
- depositing electrical insulator material(s) inside the hole in the silicon substrate;
- Patterning one or more hole(s) inside the insulator material(s) inside the hole in the silicon substrate;
- printing electrical conductor material(s) into the hole(s) inside the insulator material(s);
- using the dried-ink conductor material(s) formed using the printed electrical conductor material(s) as part of or all of the conductor material(s) for providing electrical connection(s) from a front surface to a back surface of the silicon substrate;
- wherein the step of, depositing the electrical insulator material inside the hole in the silicon substrate comprising a step of depositing developed photo-resist material(s) as the electrical insulator material for insulating the silicon substrate and the conductor material(s) inside the hole.
3 more elements
A method for providing electrical connection(s) through a silicon substrate, comprising the steps of:
- opening a hole into the silicon substrate;
- depositing electrical insulator material(s) inside the hole in the silicon substrate;
- Patterning one or more hole(s) inside the insulator material(s) inside the hole in the silicon substrate, wherein the silicon substrate is exposed at the bottom of the hole(s);
- filling conductor material(s) into the hole(s) inside the insulator material(s) by electroplating, using a dried-ink conductor materials wherein the silicon substrate exposed at the bottom of the hole(s) provides cathode connection(s) for the electroplating process(es);
- using the conductor material(s) filled by electroplating as part(s) of the conductor material(s) that provide electrical connection(s) from the front surface to the back surface of the silicon substrate;
- and
- wherein the step of, depositing the electrical insulator material inside the hole in the silicon substrate comprising a step of depositing developed photo-resist material(s) as the electrical insulator material for insulating the silicon substrate and the conductor material(s) inside the hole.
4 more elements
Dependencies are inferred from the claim text.