Back to results
US 8,709,934 B2Granted
Electronic system with vertical intermetallic compound
AssigneeSTATS ChipPAC, Ltd.
InventorsBaeYong Kim, Bongsuk Choi, Oh Han Kim
Life of this patent
Estimating the term…
Abstract
An electronic system is provided including forming a substrate having a contact, forming a conductive structure over the contact, mounting an electrical device having an external interconnect over the conductive structure, and forming a conductive protrusion from the conductive structure in the external interconnect.
Claims9
A method of manufacture of an electronic system comprising:
- forming a substrate having a contact;
- forming a conductive structure over and directly in contact with the contact;
- mounting an electrical device having an external interconnect over the conductive structure;
- and
- forming a conductive protrusion from the conductive structure in the external interconnect, wherein forming the conductive protrusion includes:
- forming a conductive core over the contact, and
- forming a transition cover of an intermetallic compound around the conductive core, the transition cover having a sidewall portion around the conductive core and contacting the contact, the sidewall portion extending vertically along the sides of the conductive core, wherein the transition cover includes a cap portion integral with the sidewall portion, and wherein the cap portion includes a convex top surface and a planar bottom surface.
4 more elements
A method of manufacture of an electronic system comprising:
- forming a substrate having a contact;
- forming a conductive structure including copper or nickel over and directly in contact with the contact;
- mounting an electrical device having an external interconnect including solder over the conductive structure;
- and
- forming a conductive protrusion from the conductive structure in the external interconnect, wherein forming the conductive protrusion includes:
- forming a conductive core over the contact, and
- forming a transition cover of an intermetallic compound around the conductive core, the transition cover having a sidewall portion around the conductive core and contacting the contact, the sidewall portion extending vertically along the sides of the conductive core, wherein the transition cover includes a cap portion integral with the sidewall portion, and wherein the cap portion includes a convex top surface and a planar bottom surface.
4 more elements
Dependencies are inferred from the claim text.