Laser processing method and apparatus
AssigneeAsm Technology Singapore Pte Ltd
InventorsChi Hang Kwok, Chi Wah Cheng, Lap Kei Chow
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Abstract
A laser processing method is disclosed, comprising the steps of: directing a laser beam to a workpiece; and effecting a relative motion between the laser beam and the workpiece. In particular, the step of directing the laser beam to the workpiece comprises focusing the laser beam within the workpiece until an internal damage forms within the workpiece and a crack propagates from the internal damage to at least one surface of the workpiece to form a surface crack on the workpiece. Further, the step of effecting the relative motion between the laser beam and the workpiece is such that the surface crack on the workpiece propagates along a line of separation on the workpiece. A laser processing apparatus is also disclosed.
Claims3
A laser processing method comprising the steps of:
- directing a laser beam to a workpiece;
- and
- effecting relative motion between the laser beam and the workpiece,
- wherein the step of directing the laser beam to the workpiece comprises focusing the laser beam within the workpiece until internal damage forms within the workpiece and a crack propagates from the internal damage to at least one surface of the workpiece to form a surface crack on the workpiece, and
- the step of effecting the relative motion between the laser beam and the workpiece is such that the surface crack on the workpiece propagates along a line of separation on the workpiece.
Dependencies are inferred from the claim text.