Method of forming a semiconductor package
AssigneeSamsung Electronics Co., Ltd.
InventorsJi-hyun Park, Heungkyu Kwon, Min-Ok Na, Taehwan Kim
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Abstract
A semiconductor package includes a substrate having an insulation layer. The insulation layer has a first region having a first surface roughness and a second region having a second surface roughness. A semiconductor chip is mounted in the first region, and an underfill resin solution is filled into the space between the semiconductor chip and the insulation layer. The roughness of the second region prevents the underfill resin from flowing out from the semiconductor chip to thereby reduce a size of the semiconductor package.
Claims12
A method of forming a semiconductor package, comprising:
- forming a substrate having at least a first area including a plurality of connection terminals and a second area to surround at least a portion of the first area;
- forming an insulating layer on the substrate to have a first region corresponding to the first area of the substrate and a second region corresponding to the second area of the substrate;
- and
- treating a surface of the insulating layer so that the second region of the insulating layer has a surface roughness different from the first region of the insulating layer.
Dependencies are inferred from the claim text.