Integrated circuit packaging system with an encapsulation and method of manufacture thereof
AssigneeSTATS ChipPAC, Ltd.
InventorsDaeWook Yang, Yeongbeom Ko
Life of this patent
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Abstract
A method of manufacture of an integrated circuit packaging system includes: forming an integrated circuit device having a device contact surface, a device lateral side, and a device backside opposite the device contact surface; forming a device shell, having a shell lip, contiguous with the device backside and the device lateral side, the shell lip adjacent to and coplanar with the device contact surface; attaching a substrate to the integrated circuit device, the device shell between the integrated circuit device and the substrate; and forming an encapsulation on the substrate and covering the integrated circuit device and the device shell.
Claims20
A method of manufacture of an integrated circuit packaging system comprising:
- forming an integrated circuit device having a device contact surface, a device lateral side, and a device backside opposite the device contact surface;
- forming a device shell, having a shell lip, contiguous with the device backside and the device lateral side, the shell lip adjacent to and coplanar with the device contact surface;
- attaching a substrate to the integrated circuit device, the device shell between the integrated circuit device and the substrate;
- and
- forming an encapsulation on the substrate and covering the integrated circuit device and the device shell.
A method of manufacture of an integrated circuit packaging system comprising:
- forming an integrated circuit device having a device contact surface, a device lateral side, and a device backside opposite the device contact surface;
- forming a device shell, having a shell lip, contiguous with the device backside and the device lateral side, the shell lip adjacent to and coplanar with the device contact surface;
- attaching a substrate, having a substrate first side and a substrate second side facing away from the substrate first side, to the integrated circuit device, the device shell between the integrated circuit device and the substrate;
- and
- forming an encapsulation on the substrate first side and covering the integrated circuit device and the device shell.
An integrated circuit packaging system comprising:
- an integrated circuit device having a device contact surface, a device lateral side, and a device backside opposite the device contact surface;
- a device shell, having a shell lip, contiguous with the device backside and the device lateral side, the shell lip adjacent to and coplanar with the device contact surface;
- a substrate attached to the integrated circuit device, the device shell between the integrated circuit device and the substrate;
- and
- an encapsulation on the substrate and covering the integrated circuit device and the device shell.
Dependencies are inferred from the claim text.