Electronic device
AssigneeInfineon Technologies AG
InventorsManfred Schneegans, Holger Torwesten
Life of this patent
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Abstract
An electronic device is disclosed. In one embodiment, the electronic device includes a substrate, a plurality of conducting lines formed on a first conducting material that is disposed on the substrate, and a layer of a second conducting material disposed on the plurality of conducting lines. The conducting lines include a top face and a side face. The layer of the second conducting material includes a first thickness disposed on each of the top faces and a second thickness disposed on each of the side faces. To this end, the first thickness is greater than the second thickness.
Claims12
A method of making an electronic device including protecting sidewalls of conducting lines on a semiconductor chip comprising:
- providing a semiconductor substrate and a first conducting material disposed on the substrate;
- forming a plurality of conducting lines on the first conducting material;
- depositing a second conducting material on a top face and on a side face of each of the plurality of conducting lines;
- and
- configuring a thickness of the second conducting material deposited on each side face to be less than a thickness of the second conducting material deposited on each top face.
A method of making a device including protecting sidewalls of conducting lines on a semiconductor chip comprising:
- providing a semiconductor substrate and a first conducting material disposed on the substrate;
- forming a plurality of conducting lines on the first conducting material;
- depositing a second conducting material having a first thickness on a top face and a second thickness on a side face of each of the plurality of conducting lines;
- and
- configuring the second thickness of the second conducting material deposited on each side face to be less than the first thickness of the second conducting material deposited on each top face wherein the first thickness is at least twice the second thickness.
Dependencies are inferred from the claim text.