Power device and method of packaging same
AssigneeFreescale Semiconductor, Inc.
InventorsJinzhong Yao, Zhigang Bai, Xuesong Xu
Life of this patent
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Abstract
A method of packaging a power semiconductor die includes providing a first lead frame of a dual gauge lead frame. The first lead frame includes a thick die pad. A tape is attached to a first side of the thick die pad and the power die is attached to a second side of the thick die pad. A second lead frame of the dual gauge lead frame is provided. The second lead frame has thin lead fingers. One end of the lead fingers is attached to an active surface of the power die such that the lead fingers are electrically connected to bonding pads of the power die. A molding compound is then dispensed onto a top surface of the dual gauge lead frame such that the molding compound covers the power die and the lead fingers.
Claims13
A method of packaging an integrated circuit, comprising the steps of:
- providing a first lead frame of a dual gauge lead frame, the first lead frame comprising a thick die pad;
- attaching a tape to a first side of the thick die pad;
- attaching a power semiconductor die to a second side of the thick die pad;
- providing a second lead frame of the dual gauge lead frame, the second lead frame comprising a plurality of thin lead fingers;
- directly attaching first ends of the lead fingers to bonding pads on an active surface of the power semiconductor die such that the lead fingers are in contact with and electrically connected to the bonding pads;
- and
- dispensing a molding compound onto a top surface of the dual gauge lead frame such that the molding compound covers the power semiconductor die and the lead fingers.
A method of packaging a power semiconductor device, comprising the steps of:
- providing a power frame having a plurality of die pads;
- attaching power semiconductor dies to respective die pads of the power frame;
- singulating the power frame to form individual power frame assemblies, each power frame assembly having at least one die mounted on at least one die pad;
- attaching a tape to a first side of the individual power frame assemblies;
- attaching input-output lead frames having lead fingers to an active surface of each of the power semiconductor dies, wherein said attaching also electrically connects the input-output lead frames to respective power semiconductor dies, and wherein a thickness of the input-output lead frame is less than a thickness of the power frame;
- dispensing a molding compound onto a top surface of the power frame assemblies such that the molding compound covers the power semiconductor dies, the power frames and the lead fingers;
- and
- singulating the input-output lead frames to form individual power semiconductor device packages.
Dependencies are inferred from the claim text.