Manufacturing method for semiconductor device carrier and semiconductor package using the same

A method of manufacturing a semiconductor device carrier comprising:

• providing a conductive carrier having a first surface and a second surface opposite the first surface;
• forming a conductive trace layer on the second surface of the conductive carrier;
• forming a conductive stud layer on the conductive trace layer;
• forming a dielectric layer to encapsulate the conductive trace layer and the conductive stud layer, wherein the conductive stud layer is exposed from the dielectric layer;
• forming a plating conductive layer to envelop the conductive carrier, the dielectric layer and the exposed conductive stud layer;
• forming at least one cavity on the conductive carrier by removing a portion of the conductive carrier, wherein
• the cavity exposes the conductive trace layer,
• the remaining portion of the conductive carrier forms a plating ring around the peripheral of the dielectric layer, and
• the plating ring is electrically connected to the conductive trace layer via the plating conductive layer and the conductive stud layer;
• forming a first surface finishing on at least a portion of the exposed conductive trace layer in the cavity;
• and
• removing the plating conductive layer.