Leadless integrated circuit packaging system and method of manufacture thereof
AssigneeSTATS ChipPAC, Ltd.
InventorZigmund Ramirez Camacho
Life of this patent
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Abstract
A method of manufacture of a leadless integrated circuit packaging system includes: providing a substrate; patterning a die attach pad on the substrate; forming a tiered plated pad array around the die attach pad; mounting an integrated circuit die on the die attach pad; coupling an electrical interconnect between the integrated circuit die and the tiered plated pad array; forming a molded package body on the integrated circuit die, the electrical interconnects, and the tiered plated pad array; and exposing a contact pad layer by removing the substrate.
Claims20
A method of manufacture of a leadless integrated circuit packaging system comprising:
- providing a substrate;
- patterning a die attach pad on the substrate;
- forming a tiered plated pad array having plated pads around the die attach pad, the plated pads along a lateral direction away from the die attach pad having additional layers of a spacer metal for progressively increasing the height of the plated pads in a direction away from the die attach pad;
- mounting an integrated circuit die on the die attach pad;
- coupling an electrical interconnect between the integrated circuit die and the tiered plated pad array;
- forming a molded package body on the integrated circuit die, the electrical interconnects, and the tiered plated pad array;
- and
- exposing a contact pad layer by removing the substrate.
A method of manufacture of a leadless integrated circuit packaging system comprising:
- providing a substrate including having a planar surface on the substrate;
- patterning a die attach pad on the substrate including applying a first mask layer on the planar surface;
- forming a tiered plated pad array having plated pads around the die attach pad, the plated pads along a lateral direction away from the die attach pad having additional layers of a spacer metal for progressively increasing the height of the plated pads in a direction away from the die attach pad;
- mounting an integrated circuit die on the die attach pad including applying an adhesive between the die attach pad and the integrated circuit die;
- coupling an electrical interconnect between the integrated circuit die and the tiered plated pad array;
- forming a molded package body on the integrated circuit die, the electrical interconnects, and the tiered plated pad array;
- and
- exposing a contact pad layer by removing the substrate including providing a package contact in the molded package body.
A leadless integrated circuit packaging system comprising:
- a die attach pad;
- a tiered plated pad array having plated pads around the die attach pad, the plated pads along a lateral direction away from the die attach pad having additional layers of a spacer metal for progressively increasing the height of the plated pads in a direction away from the die attach pad;
- an integrated circuit die mounted on the die attach pad;
- an electrical interconnect coupled to the tiered plated pad array and the integrated circuit die;
- a molded package body on the integrated circuit die, the electrical interconnects, and the tiered plated pad array;
- and
- a contact pad layer on a package bottom of the molded package body.
Dependencies are inferred from the claim text.