Integrated circuit with electromagnetic intrachip communication and methods for use therewith
AssigneeBroadcom Corporation
InventorAhmadreza (Reza) Rofougaran
Life of this patent
Estimating the term…
Abstract
An integrated circuit includes a substrate and a first integrated circuit die having a first circuit coupled to the substrate via a first bonding wire, the first circuit having a first intra-chip interface. A second integrated circuit die has a second circuit coupled to the substrate via a second bonding wire, the second circuit having a second intra-chip interface, the second bonding wire electrically isolated from the first bonding wire. The first circuit communicates with the second circuit via the first intra-chip interface and the second intra-chip interface, and wherein the first intra-chip interface and the second intra-chip interface communicate via a first electromagnetic coupling between the first bonding wire and the second bonding wire.
Claims25
A method comprising:
- interfacing a first circuit of a first integrated circuit die to a second circuit of a second integrated circuit die via a first electromagnetic coupling between a first bonding wire that couples the first circuit to a substrate and a second bonding wire that couples the second circuit to the substrate;
- wherein the first integrated circuit die is stacked onto the second integrated circuit die and the second bonding wire is electrically isolated from the first bonding wire.
A method comprising:
- interfacing a first circuit of an integrated circuit to a second circuit of the integrated circuit via a first electromagnetic coupling between a first bonding wire that couples the first circuit to a substrate and a second bonding wire that couples the second circuit to the substrate;
- wherein the first circuit is stacked onto the second circuit and the second bonding wire is electrically isolated from the first bonding wire.
A method comprising:
- interfacing a first circuit of an integrated circuit to a second circuit of the integrated circuit via a first electromagnetic coupling between a first bonding wire that couples the first circuit to a substrate and a second bonding wire that couples the second circuit to the substrate;
- wherein the first circuit is stacked onto the second circuit and the second bonding wire is electrically isolated from the first bonding wire;
- and
- wherein at least one of the first circuit and the second circuit include components of a wireless interface device for communication with an external network.
Dependencies are inferred from the claim text.