Sensor packages and method of packaging dies of differing sizes

A method of forming electronic component packages comprising:

• placing a plurality of first electronic components in an array arranged to correspond with locations of second electronic components formed on a first wafer;
• encapsulating said array in a mold material to form a panel of said first electronic components;
• bonding a bottom side of said wafer to an outer surface of said panel to form a stacked wafer structure of said first and second electronic components;
• and
• dicing said stacked wafer structure to produce said electronic component packages, wherein said method further comprises:
• dicing a second wafer, said second wafer including a plurality of said first electronic components, and wherein said second wafer comprises a wafer structure that includes said first electronic components arranged in pairs in said wafer structure, each of said first electronic components having first bond pads, wherein said first bond pads of a first one of said first electronic components are adjacent to said first bond pads of a second one of said second electronic components in each of said pairs of said first electronic components, and said dicing said second wafer comprises producing said first electronic components in the form of said pairs of said first electronic components for placement in said array.

A method of forming sensor packages comprising:

• dicing a sensor wafer to produce sensor elements, said sensor wafer including a plurality of sensor dies, each of said sensor elements including at least one of said sensor dies and first bond pads;
• placing said sensor elements in an array arranged to correspond with locations of controller dies in a controller wafer, said controller wafer having a top side and a bottom side opposing said top side, said top side including said controller dies, each of said controller dies including second bond pads, a first surface area of each of said controller dies being greater than a second surface area of each of said sensor dies, and said placing operation includes distributing said sensor elements in said array to align said sensor dies with said controller dies;
• encapsulating said array in a mold material to form a panel of said sensor elements, wherein said first bond pads are concealed by at least one of said controller wafer and a portion of said panel;
• bonding said bottom side of said controller wafer to an outer surface of said panel to form a stacked wafer structure of said controller dies and said sensor elements;
• following said bonding operation, removing a material section from said at least one of said controller wafer and said portion of said panel of said stacked wafer structure to expose said first bond pads;
• forming electrical interconnects between said first and second bond pads;
• and
• dicing said stacked wafer structure to produce said sensor packages.

A method of forming electronic component packages comprising:

• dicing a first wafer to produce first electronic components, said first wafer including a plurality of said first electronic components, each of said first electronic components including first bond pads;
• placing said first electronic components in an array arranged to correspond with locations of second electronic components formed on a second wafer, each of said second electronic components including second bond pads;
• encapsulating said array in a mold material to form a panel of said first electronic components;
• bonding a bottom side of said second wafer to an outer surface of said panel to form a stacked wafer structure of said first and second electronic components, said first bond pads being concealed by at least one of said wafer and a portion of said panel;
• following said bonding operation, removing a material section from said at least one of said wafer and said portion of said panel of said first electronic components to expose said first bond pads;
• forming electrical interconnects between said first and second bond pads;
• and
• dicing said stacked wafer structure to produce said electronic component packages.