Dual-leadframe multi-chip package and method of manufacture

A method for manufacturing a dual-leadframe multi-chip package, comprises the following steps:

• Step 1:
• provide a first leadframe comprising a first die pad and multiple outer pins;
• Step 2:
• mount a first chip on the first die pad with a bottom contact area of the first chip electrically connected to the first die pad, mount a third chip on the first die pad with a bottom contact area of the third chip electrically connected to the first die pad;
• Step 3:
• provide a second leadframe having a second die pad, electrically connect a top contact area of the first chip to the second die pad;
• Step 4:
• mount a second chip on the second die pad with a bottom contact area of the second chip electrically connected to the second die pad;
• Step 5:
• provide a top connecting plate for electrically connecting a top contact area of the second chip and a top contact area of the third chip to an outer pin of the first leadframe;
• Step 6:
• electrically connect a top gate contact area of the first chip to an outer pin of the first leadframe, electrically connect a top gate contact area of the second chip to an outer pin of the first leadframe;
• Step 7:
• clean the first and second leadframes, apply plastic package to encapsulate the first and second die pads, the top connecting plate and the chips such that only part of outer pins of the leadframes exposed.