Fabrication method of packaging substrate having through-holed interposer embedded therein
AssigneeUnimicron Technology Corp.
InventorsYu-Shan Hu, Dyi-Chung Hu, Tzyy-Jang Tseng
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Abstract
A packaging substrate having a through-holed interposer embedded therein and a fabrication method of the packaging substrate are provided, where the packaging substrate includes: a molding layer having opposite first and second surfaces; a through-holed interposer embedded in the molding layer and flush with the second surface; a redistribution-layer structure embedded in the molding layer and disposed on the through-holed interposer and having a plurality of electrode pads exposed from the first surface of the molding layer; and a built-up structure disposed on the second surface of the molding layer and electrically connected to the through-holed interposer.
Claims12
A fabrication method of a packaging substrate having a through-holed interposer embedded therein, comprising the steps of:
- providing a through-holed interposer having a redistribution-layer structure disposed thereon, wherein the through-holed interposer has a first side and an opposite second side and a plurality of conductive through holes penetrating the first side and the second side, each of the conductive through holes has a first end surface on the first side and a second end surface on the second side, the redistribution-layer structure is formed on the first side of the through-holed interposer and the first end surfaces of the conductive through holes and electrically connected to the first end surfaces of the conductive through holes, the second end surfaces of the conductive through holes are flush with the second side of the through-holed interposer so as to allow the second side and the second end surfaces of the conductive through holes to be attached to a carrier board, and an outermost layer of the redistribution-layer structure has a plurality of electrode pads;
- forming a molding layer on the carrier board and the redistribution-layer structure so as to embed the through-holed interposer in the molding layer, wherein the molding layer has an exposed first surface and a second surface attached to the carrier board;
- forming a metal layer on the first surface of the molding layer;
- removing the carrier board to expose the second surface of the molding layer, the second side of the through-holed interposer and the second end surfaces of the conductive through holes;
- forming a built-up structure on the second surface of the molding layer, the second side of the through-holed interposer, and the second end surfaces of the conductive through holes, wherein the built-up structure comprises a plurality of conductive vias, wherein a portion of the conductive vias are electrically connected to the second end surfaces of the conductive through holes;
- removing the metal layer to expose the first surface of the molding layer;
- and
- forming a plurality of first openings on the first surface of the molding layer for exposing the electrode pads, respectively.
Dependencies are inferred from the claim text.