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US 8,709,844 B2Granted
Light emitting diode package and method of fabricating the same
AssigneeLG Display Co., Ltd.
InventorsSin-Ho Kang, Tae-Hun Kim, Seung-Ho Jang, Kyoung-Bo Han, Jae-yong Choi
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Abstract
A light emitting diode (LED) package and a method of manufacturing a LED package is provided. The LED package includes a case having first and second lead frames disposed through the case; an LED chip disposed on the case, the LED chip having first and second electrodes directly connected to the first and second lead frames through a eutectic bond, respectively; and a lens disposed over the case covering the LED chip.
Claims11
A method of fabricating a light emitting diode (LED) package, comprising:
- forming a case having first and second lead frames on a surface thereof;
- forming a LED chip having a transparent substrate, a LED structure, a first electrode and a second electrode;
- positioning the LED chip on the case such that the first and second electrodes directly contact the first and second lead frames;
- irradiating electromagnetic radiation onto the contact portion between the first electrode and the first lead frame as well as the second electrode and the second lead frame to generate eutectic bonding,
- wherein the step of forming the case includes forming an insulator, which has substantially the same height as the first and second lead frames from the surface of the case, disposed on the surface the case and between the first and second lead frames, and the insulator protrudes from the first and second lead frames by the step of irradiating the electromagnetic radiation.
2 more elements
Dependencies are inferred from the claim text.