Method of manufacturing nitride semiconductor and nitride semiconductor element
AssigneeRohm Co., Ltd.
InventorYukio Shakuda
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Abstract
The present invention provides a method of manufacturing a nitride semiconductor capable of improving the crystallinity and the surface state of the nitride semiconductor crystal formed on top of a high-temperature AlN buffer layer. An AlN buffer layer is formed on top of a growth substrate, and then nitride semiconductor crystals are grown on top of the AlN buffer layer. In a stage of manufacturing the nitride semiconductor, the crystal of the AlN buffer layer is grown at a high temperature of 900° C. or higher. In addition, an Al-source material of the AlN buffer layer is started to be supplied first to a reaction chamber and continues to be supplied without interruption, and then a N-source material is supplied intermittently.
Claims7
A method of manufacturing a nitride semiconductor in which a nitride semiconductor crystal is grown on top of an AlN buffer layer, comprising:
- forming the AlN buffer layer to have a film thickness of 20 Å or smaller, by starting supply of an Al-source material at a growth temperature of 900° C. or higher, and then supplying a N-source material intermittently and continuing to supply the Al-source material without interruption.
Dependencies are inferred from the claim text.